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8 June 2015

„Hi-Tech Projects” Ltd in cooperation with the society „Latvian Electrical Engineering and Electronics Industry Association” (LETERA) participating in European Union funds to the project „Latvian Electronics and Electrical Engineering Industry Cluster” (project No. KAP/2.3.2.3.0/12/01/003)

The project is implemented within the framework of the operational programme „Entrepreneurship and innovation” Appendix 2.3.2.3. Activity „The cluster program”, following the 12 September 2012 agreement for the implementation of the project No. L-KAP-12-0002, concluded between the LETERA and national agency „The Investment and Development Agency of Latvia”.

Project duration: 2012-2015.

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30 May 2015

„Hi-Tech Projects” Ltd in cooperation with the national agency „The Investment and Development Agency of Latvia” (LIAA) and with Latvian electrical and optical equipment industry competence centre (LEO PC) completed the research project No.1.27 “Development of Building structure deformation monitoring sensor”, co-funded with European Regional Development Fund (ERAF).

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1. august 2014.

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“Hi-Tech Projects” Ltd. in cooperation with the Investment and Development Agency of Latvia (LIAA) and with the Latvian electrical and optical equipment industry competence centre has started the research project No.1.27 “Development of Building structure deformation monitoring sensor”, co-funded with European Regional Development Fund (ERDF).

Individual research is implemented in accordance with the operational program “Entrepreneurship and Innovation” following requirements of the sub activity “Centres of Competence”.
The goal of the project is to develop a new prototype wireless sensor that monitors the deformation of building structures and provides the transmission of information about the characteristics of deformations.


31. march 2014.

"Hi-Tech Projects" Ltd. in cooperation with "Volburg" Ltd. researchers completed the project
"Development of the methodology of soldering, bonding and varnishing".

As a result, based on compilations of results of the research, a new concept of technology was created and recommendations were provided for electronic manufacturing companies to improve the quality indicators of soldering, bonding and varnishing processes.

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